Skip to datasheet
The Engineering ProjectsAI Interactive Datasheet

BME280Humidity, pressure and temperature sensor

Three environmental channels in one miniature metal package.

Manufacturer-referenced

Bosch Sensortec · BME280

LGA-8BST-BME280-DS001-24 · February 2024

BME280 is a miniature digital sensor that measures humidity, barometric pressure and temperature. Its sensing elements and mixed-signal electronics share an eight-contact metal-lid LGA package. I²C and SPI provide the interface to a microcontroller; the IC itself has no display or regulator. The BME280 adds humidity sensing to the pressure and temperature channels. Raw conversion data must be compensated with calibration coefficients read from that individual sensor. Temperature compensation is performed first because the pressure and humidity calculation depends on its intermediate result. The example uses both supplies at 3.3 V, two local bypass capacitors and an I²C address of 0x76. Pin numbering runs clockwise in the top view, so pad 1 is at the upper right. The illustrated 25°C and 1000 hPa / 50% RH readings explain units; they are not measurements from a connected sensor.

3D View

Preparing 3D preview…
3D packageDrag to rotate · Scroll to zoom

Real View

BME280 metal-lid LGA sensor with a vent and eight underside contacts.
BME280 · LGA-8Package illustration

Pinout

BME280LGA-8Top view · clockwise numbering
Select a pin to see its functionLGA-8 · 8 pins

PCB Footprint

Loading footprint…
Powered by
Finding LGA-8 packageTop view · mm
Supplies and groundsMode and addressSerial interface
BME280LGA-8Top view · clockwise numbering

Click a lead or use the arrow keys. Top view · clockwise numbering

1
PIN 1 · Supplies and grounds

GND

Ground

Function

First ground pad.

How to connect

Join common ground; connect pad 7 too.

At a glance

Humidity, pressure and temperature sensor

Factory calibration belongs to each individual sensor. Read its coefficients, acquire a complete result and apply the manufacturer compensation in the correct order.

300–1100 hPaPressure range
1.71–3.6 VMain supply
0–100 % RH · non-condensingHumidity range
−40–85 °COperating temperature

Operating profile

BME280

Bare sensor
LGA-82.5 × 2.5 × .93 mm
I²C address
0x76 / 0x77Selected by SDO
Typical 1 Hz current
3.6 µAHumidity, pressure and temperature

Supply and environment

Key parameters and their test conditions

VDD main supply
1.71–3.6 VConditions / notes: 3.3 V in the example
VDDIO supply
1.2–3.6 VConditions / notes: Sets the digital logic domain
Operating temperature
−40 to +85°CConditions / notes: Accuracy conditions are narrower
Pressure range
300–1100 hPaConditions / notes: Absolute pressure
Humidity range
0–100% RHConditions / notes: Non-condensing; observe the temperature/RH operating envelope
Startup before communication
2 msConditions / notes: Also wait until status.im_update clears

Package details

Follows the selected physical package

Manufacturer
Bosch Sensortec
Part number
BME280
Package
LGA-8
Connections
8 pins
Mounting
SMD
Lead pitch
0.65 mm
Package code
Metal-lid LGA
Thermal reference
Keep the vent open and isolate from board heat

Connections by function

Select a pin to open its function, electrical notes and wiring guidance.

Supplies and grounds4 pins

Mode and address2 pins

Serial interface2 pins

Power and identify

Supply both domains, wait for startup and NVM copying, then confirm chip ID 0x60 at register 0xD0.

Configure and acquire

Write ctrl_hum 0xF2 = 0x01, then write ctrl_meas 0xF4 = 0x25 for ×1 temperature, ×1 pressure and forced mode. Wait for this conversion to complete.

Compensate and display

Burst-read eight bytes from 0xF7. Decode raw fields, use this sensor’s calibration and convert pressure from Pa to hPa by dividing by 100.

Use VDDIO-compatible pull-ups. Read temperature first for compensation, then pressure and humidity.

BME280 cutaway with sensing elements, ADC, calibration NVM and serial registers.
Original functional architecture; compensation is performed by host software.
BME280 physical LGA top view with CSB high, SDO low, two bypass capacitors and I2C pull-ups to 3.3 V.
Matching named nodes are connected; displayed values are illustrative.

Pin reference

Select a pin to explore its function and connection.

8 pins
PinSignalTypeFunction
GNDGroundFirst ground pad.
CSBActive-low SPI selectSelects the digital interface.
SDI / SDASerial dataSPI input, shared three-wire data or I²C bidirectional data.
SCK / SCLSerial clockSPI or I²C clock from the host.
SDO / ADDRSPI output / I²C addressSPI serial output; the I²C address bit is sampled from its level.
VDDIOInterface supplySupplies the digital input/output domain.
GNDGroundSecond ground pad.
VDDSensor supplyPowers the analog sensing and conversion circuitry.
LGA-8 · Top view · clockwise numbering · Select a pin number to inspect its connection.

Supply and environment

Recommended operating conditions

ParameterValueConditions / notes
VDD main supply1.71–3.6 V3.3 V in the example
VDDIO supply1.2–3.6 VSets the digital logic domain
Operating temperature−40 to +85°CAccuracy conditions are narrower
Pressure range300–1100 hPaAbsolute pressure
Humidity range0–100% RHNon-condensing; observe the temperature/RH operating envelope
Startup before communication2 msAlso wait until status.im_update clears
Sleep current0.1 µA typicalSensor sleep; excludes external pull-ups and controller

Do not connect 5 V logic or pull-ups to the bare sensor.

Measurement performance

Typical or stated accuracy conditions

ParameterValueConditions / notes
Pressure absolute accuracy±1 hPa300–1100 hPa, 0–65°C
Relative pressure accuracy±0.12 hPa700–900 hPa; 25–40°C
Temperature accuracy±0.5°C at 25°CInternal die temperature; board heating affects ambient estimates
Humidity accuracy±3% RH20–80% RH at 25°C, including hysteresis
Humidity response τ631 sSpecified airflow and step conditions
Filtered pressure noise0.2 Pa RMS typicalHighest oversampling and lowest bandwidth
Typical current at 1 Hz3.6 µAHumidity, pressure and temperature

Resolution, noise, accuracy and conversion speed describe different limitations.

Digital interfaces

I²C and SPI configuration

ParameterValueConditions / notes
I²C chip selectionCSB2 tied to VDDIORequired from power-on reset
I²C data / clockSDI3 = SDA; SCK4 = SCLPull both bus lines to VDDIO
SDO5 low / high0x76 / 0x77Seven-bit addresses; do not float
I²C maximum clock3.4 MHzUse the required high-speed protocol; example is 100 kHz
SPI maximum clock10 MHzObserve setup, hold and output delay conditions
4-wire SPICSB, SCK, SDI, SDOSeparate input and output data
3-wire SPICSB, SCK and shared SDISet spi3w_en; SDO is unused

A module may contain its own pull-ups or regulator. Inspect its schematic separately.

Registers and calibration

Read whole measurement groups coherently

ParameterValueConditions / notes
0xD0 chip ID0x60Distinguishes the selected part
0xE0 resetWrite 0xB6Wait for startup / coefficient copy
0xF3 statusBit 3 measuring; bit 0 im_updateDo not read an old result as a just-triggered conversion
0xF4 ctrl_measTemperature / pressure oversampling and modeExample 0x25 = ×1 / ×1 / forced
0xF2 ctrl_humHumidity oversamplingWrite 0x01 before ctrl_meas; change latches on ctrl_meas write
0xF5 configStandby time, IIR and 3-wire selectionConfigure in sleep; example filter off
0xF7–0xFC20-bit pressure + 20-bit temperatureMSB, LSB and upper nibble of XLSB
0xFD–0xFE16-bit humidityRead in the same eight-byte burst
CalibrationTemperature / pressure from 0x88 onwardAdditional humidity coefficients at 0xA1 and 0xE1–0xE7

Preserve signed coefficient types and packed fields; raw ADC data is not already °C, Pa or % RH.

Acquisition modes and timing

Noise, response and current trade-offs

ParameterValueConditions / notes
SleepNo measurementsRegisters remain accessible
ForcedOne measurement, then sleepHost triggers the next result
NormalRepeated measurement and standbyChoose standby for the required update rate
OversamplingSkipped or ×1 / ×2 / ×4 / ×8 / ×16Each enabled channel configured separately
IIROff / 2 / 4 / 8 / 16Pressure and temperature; not humidity
Example conversion maximum9.3 ms×1 temperature and pressure and humidity; manufacturer timing formula
Fresh result checkWait for the conversion to finishAllow the full bounded duration or observe the busy-to-idle transition

Firmware must allow startup and bus time as well as the acquisition itself.

3.3 V I²C measurement

A bare-sensor connection

ParameterValueConditions / notes
VDD8 and VDDIO63.3 VSeparate 100 nF capacitors to common ground
GND1 and GND7Common groundConnect both pads
CSB23.3 VSelect I²C from startup
SDO5GNDAddress 0x76
SDA3 and SCL43.3 V controller4.7 kΩ example pull-ups; verify bus rise time
Firmware orderReset / wait / coefficients / configuration / convert / readTemperature compensation before dependent channels
Display examples25.0°C · 1000.0 hPa · 50.0% RHIllustrative engineering-unit values, not live readings

The display belongs to the host system, not the sensor package.

Package and assembly

Clockwise top-view numbering

ParameterValueConditions / notes
Package body2.5 × 2.5 × 0.93 mmEight-contact metal-lid LGA
Pad pitch0.65 mmFour contacts on each of two opposite sides
Top-view orderRight: 1,2,3,4 · left: 8,7,6,5Top to bottom; bottom view is mirrored
Vent openingKeep clearAvoid coating, adhesive or contamination in the port
Thermal placementAway from hot ICs and airflow artifactsTemperature senses package conditions
PCB lands0.50 × 0.35 mm; 2.05 mm row centersBased on Bosch Figure 21
Humidity handlingObserve reconditioning guidance after solderingReview the complete manufacturer assembly instructions

The bare IC and a breakout module have different size, pinout and supporting circuitry.

Take it into ProTech

Find BME280 in the Components Library to place its schematic symbol and connect its pins.

Working Arduino sensor example available in ProTechOpen ProTech

Component view