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MPU6050Six-axis accelerometer and gyroscope

Measure acceleration and rotation in three dimensions.

Manufacturer-referenced

InvenSense · MPU-6050

QFN-24PS-MPU-6000A-00 Rev. 3.4 · August 2013

MPU6050 combines a three-axis accelerometer and three-axis gyroscope with 16-bit conversion in a 4 mm QFN package. Selectable ranges cover ±2 to ±16 g and ±250 to ±2000 degrees per second; a temperature channel, digital filters and a 1024-byte FIFO support motion acquisition. Its main host interface is I²C, with an auxiliary I²C master for external sensors. It has no built-in magnetometer, and SPI support in the combined manufacturer document belongs to MPU6000. The bare MPU6050 needs VDD, VLOGIC and the specified regulator and charge-pump capacitors. Read each signed measurement using the configured scale, remove measured offsets and account for the sensor axes. Acceleration includes gravity, while gyro output is angular rate rather than an absolute angle. This page follows the original MPU6050 package and assembly rules, including leaving its exposed die pad unsoldered.

Real View

Original black MPU-6050 4 mm QFN with twenty-four bright silver edge contacts, pin-one dot and centered marking.
MPU-6050 · QFN-24Package illustration

Pinout

MPU-6050QFN-24Top view · counterclockwise numbering
Select a pin to see its functionQFN-24 · 24 pins

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ClocksUnused / reservedSerial dataSuppliesAddress / synchronizationFilter capacitorsInterruptGround
MPU-6050QFN-24Top view · counterclockwise numbering

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1
PIN 1 · Clocks

CLKIN

Input

Function

Optional external reference clock.

How to connect

Ground when unused; the example uses an internal gyro PLL.

At a glance

Six-axis accelerometer and gyroscope

MEMS acceleration and angular-rate channels pass through conversion and digital filtering. The host can read raw measurements, drain the FIFO or use supported motion-processing software. Temperature is a separate on-die reading.

6 3 acceleration + 3 rotationMotion axes
±2–16 gAcceleration ranges
±250–2000 °/sGyroscope ranges
2.375–3.46 VSensor supply

Operating profile

MPU-6050

Package
QFN-244 × 4 × 0.9 mm nominal
Operating temperature
−40 to +85°CDie temperature is also readable
Primary interface
I²CUp to 400 kHz; 0x68 / 0x69

Supplies and interface

Key parameters and their test conditions

VDD
2.375–3.46 VConditions / notes: Sensor supply; example uses 3.3 V
VLOGIC
1.71 V to VDDConditions / notes: Must not exceed VDD, including during power transitions
Primary interface
I²C up to 400 kHzConditions / notes: MPU6050 has no primary SPI interface
I²C address
0x68 / 0x69Conditions / notes: AD0 grounded / tied to VLOGIC
Gyro + accelerometer current
3.8 mA typicalConditions / notes: Normal operating mode; DMP disabled
Gyro + accelerometer + DMP
3.9 mA typicalConditions / notes: Typical normal-operation value

Package details

Follows the selected physical package

Manufacturer
InvenSense
Part number
MPU-6050
Package
QFN-24
Connections
24 pins
Mounting
SMD
Lead pitch
0.50 mm
Package code
QFN
Thermal reference
−40°C to +85°C

Connections by function

Select a pin to open its function, electrical notes and wiring guidance.

Clocks3 pins

Unused / reserved11 pins

Serial data2 pins

Supplies2 pins

Address / synchronization2 pins

Filter capacitors2 pins

Interrupt1 pins

Ground1 pins

Configure and wake

Set the clock, ranges, filter and sample divider before acquisition.

Acquire a coherent burst

Read 14 bytes from 0x3B: acceleration XYZ, temperature, then gyro XYZ.

Scale and calibrate

Combine high and low bytes as signed 16-bit values, apply the selected sensitivity and remove measured offsets.

At ±2 g, divide acceleration counts by 16384. At ±250°/s, divide gyro counts by 131. Integrating gyro rate needs time and bias calibration; it does not provide an absolute compass heading.

Compact MPU6050 cutaway with three-axis acceleration and gyro blocks, ADCs, digital filtering, DMP, FIFO and I2C.
Original functional architecture. The magnetometer is external, when fitted.
MPU6050 QFN circuit with VDD and VLOGIC3.3V, REGOUT100nF, CPOUT2.2nF50V, I2C pullups, AD0 and unused clocks grounded.
Named nets are connected. NC and reserved contacts remain open; the center die pad is not soldered.

Pin reference

Select a pin to explore its function and connection.

24 pins
PinSignalTypeFunction
CLKINInputOptional external reference clock.
NCNo connectionNot internally connected.
NCNo connectionNot internally connected.
NCNo connectionNot internally connected.
NCNo connectionNot internally connected.
AUX_DABidirectionalAuxiliary I²C master data for an external sensor.
AUX_CLOutputAuxiliary I²C master clock.
VLOGICSupplyDigital interface supply for MPU-6050.
AD0InputLeast-significant bit of the seven-bit I²C address.
REGOUTRegulator filterInternal regulator output requiring a filter capacitor.
FSYNCInputExternal frame synchronization input.
INTOutputConfigurable interrupt; push-pull or open-drain.
VDDSupplySensor power supply.
NCNo connectionNot internally connected.
NCNo connectionNot internally connected.
NCNo connectionNot internally connected.
NCNo connectionNot internally connected.
GNDReturnPower and signal ground.
RESVReservedReserved package contact.
CPOUTCharge-pump filterInternal charge-pump capacitor connection.
RESVReservedReserved package contact.
RESVReservedReserved on MPU-6050.
SCLInputPrimary I²C serial clock.
SDABidirectionalPrimary I²C serial data.
QFN-24 · Top view · counterclockwise numbering · Select a pin number to inspect its connection.

Supplies and interface

Bare sensor; breakout-board limits may differ

ParameterValueConditions / notes
VDD2.375–3.46 VSensor supply; example uses 3.3 V
VLOGIC1.71 V to VDDMust not exceed VDD, including during power transitions
Primary interfaceI²C up to 400 kHzMPU6050 has no primary SPI interface
I²C address0x68 / 0x69AD0 grounded / tied to VLOGIC
Gyro + accelerometer current3.8 mA typicalNormal operating mode; DMP disabled
Gyro + accelerometer + DMP3.9 mA typicalTypical normal-operation value
Sleep current5 µA typicalExcludes the separate interface-rail contribution
Operating temperature−40°C to +85°CCalibrate offsets across the intended conditions

Observe the manufacturer power-on sequence and supply ramp requirements.

Measurement ranges and scaling

16-bit signed sensor outputs

ParameterValueConditions / notes
Accelerometer ±2 / ±4 g16384 / 8192 LSB per gACCEL_CONFIG AFS_SEL = 0 / 1
Accelerometer ±8 / ±16 g4096 / 2048 LSB per gAFS_SEL = 2 / 3
Gyroscope ±250 / ±500°/s131 / 65.5 LSB per °/sGYRO_CONFIG FS_SEL = 0 / 1
Gyroscope ±1000 / ±2000°/s32.8 / 16.4 LSB per °/sFS_SEL = 2 / 3
Temperature conversionSigned raw / 340 + 36.53°COn-die temperature, not a calibrated ambient thermometer
Stationary accelerationApproximately 1 g total magnitudeGravity remains in the accelerometer reading
Initial gyro zero-rate offsetUp to ±20°/sCalibration is needed for meaningful integration
Initial accelerometer offsetX/Y: ±50 mg; Z: ±80 mgManufacturer initial zero-g tolerances

An angular-rate reading is not an absolute orientation.

Register sequence

RM-MPU-6000A-00 Rev. 4.2

ParameterValueConditions / notes
WHO_AM_I0x75 → 0x68Does not change when AD0 selects address 0x69
PWR_MGMT_10x6BReset default is sleep; example writes 0x01 for X-gyro PLL
CONFIG0x1A → 0x03Example filter: gyro 42 Hz, acceleration 44 Hz
SMPLRT_DIV0x19 → 0x09With the enabled DLPF: 1000 / (1 + 9) = 100 Hz
GYRO_CONFIG0x1B → 0x00Example ±250°/s, self-test off
ACCEL_CONFIG0x1C → 0x00Example ±2 g, self-test off
INT_ENABLE / INT_STATUS0x38 / 0x3ABit 0 selects / reports data-ready
Coherent measurement burst0x3B–0x48, 14 bytesAccel XYZ, temperature, gyro XYZ; high byte first
FIFO count / data0x72–0x73 / 0x74FIFO capacity is 1024 bytes; handle overflow

Register reference: https://netsonic.fi/en/files/MPU6050-datasheet.pdf

Sampling and interpretation

Filter settings affect rate and latency

ParameterValueConditions / notes
Output sample formulaGyro output rate / (1 + SMPLRT_DIV)Divider is an unsigned byte
DLPF configurations 1–61 kHz gyro base rateValid low-pass-filter settings
DLPF configuration 08 kHz gyro base rateDo not use reserved configuration 7
Accelerometer base rate1 kHzHigher output rates can repeat acceleration samples
Example 100 Hz acquisitionDLPF = 3, divider = 910 ms sample interval before host scheduling effects
Signed conversionint16((high << 8) | low)Sign extension matters for negative motion
Rate-to-angle integrationAngle change ≈ corrected rate × elapsed timeGyro bias accumulates as drift
Nine-axis claimsRequires an external magnetometerNone is built into MPU6050

The illustrated readings are examples, not live measurements.

Required support components

Manufacturer typical operating circuit

ParameterValueConditions / notes
VDD13 bypass100 nF, X7R, ±10%, ≥4 VPlace near pin 13
VLOGIC8 bypass10 nF, X7R, ±10%, ≥4 VSeparate interface-rail bypass
REGOUT10 filter100 nF, X7R, ±10%, ≥2 VConnect only the filter capacitor to ground
CPOUT20 filter2.2 nF, X7R, ±10%, 50 VDo not replace with a low-voltage supply bypass
SDA24 / SCL23Pullups to VLOGIC4.7 kΩ shown for a short example bus; size for capacitance
Unused external clocksCLKIN1 and FSYNC11 → GNDDo not leave these unused inputs floating
Unused auxiliary interfaceAUX_DA6 / AUX_CL7 openKeep the auxiliary master disabled
Reserved contacts19, 21, 22 unconnectedNC and reserved are not interchangeable instructions

3.3 V is within both rail ranges. This is not a 5 V breakout circuit.

QFN and assembly rules

Original manufacturer land guidance

ParameterValueConditions / notes
Body / height4 × 4 × 0.90 mm nominal24 contacts on four sides
Contact pitch0.50 mmPin 1 upper-left; counterclockwise top view
Perimeter copper lands0.35 mm wide; 0.80 / 0.85 mm longLonger lands at each bank end; outer span 4.80 mm
Exposed die pad2.70 × 2.60 mm on the packageNo internal electrical connection
Center solder landIntentionally omittedManufacturer section 11.4.2 says do not solder the exposed pad
Routing beneath the die padNo traces or vias beneath that padFollow section 11.4.3 shielding/ground-plane advice
Mechanical stressKeep large insertion components awayManufacturer recommends at least 6 mm separation
Physical axesFollow package top-view axesBoard mounting errors cause cross-axis response

Do not substitute a generic QFN footprint with a soldered thermal pad.

Take it into ProTech

Find MPU6050 in the Components Library to place its schematic symbol and connect its pins.

Reference page · circuit simulation model not yet availableOpen ProTech

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