Explore MCP73831 pins, signal names, electrical functions and connection guidance for each package.
Select a pin to explore its connection
Click a lead or use the arrow keys. Top view rotated clockwise · three leads left, two right
LOW during preconditioning, constant-current charging and constant-voltage charging; HIGH when charging completes; high impedance during shutdown or with no battery.
An LED from the input supply through a resistor to STAT lights during charging.
MCP73831 has a driven HIGH state. Do not assume the open-drain behavior of MCP73832.
Common zero-volt reference for the charger, input source and cell.
Join the input return, battery negative, bypass returns and programming resistor.
Connect the DFN exposed pad to this same ground potential.
The integrated pass transistor supplies regulated current and voltage to the positive battery terminal.
Connect the compatible single-cell battery positive and at least 4.7 µF local bypass.
The selected -2 option regulates at 4.20 V; it is not suitable for a different cell charging voltage by assumption.
Provides charger power from a regulated input source.
Use 5.2 V in the reference example and at least 4.7 µF local bypass to VSS.
Recommended input has headroom above the cell regulation voltage; 7 V is an absolute stress limit.
A resistor to VSS programs the nominal fast-charge current. Floating PROG disables charging.
10 kΩ gives nominal 100 mA; choose a current allowed by the cell manufacturer.
Preconditioning and termination currents track the programmed current and the factory option.
This physical DFN contact is the same supply node as the other VDD contact.
Connect both VDD pads to the bypassed input supply.
Do not leave a power contact unconnected.
This physical DFN contact is the same charge-output node as the other VBAT contact.
Connect both VBAT pads to battery positive and the local bypass.
The two contacts do not represent separate charging channels.
The manufacturer assigns no external electrical function to this DFN contact.
Leave unconnected.
Do not use it as a routing junction.
The underside metal pad is internally connected to VSS and must connect to ground on the PCB.
Solder to a grounded thermal land; review copper, vias and stencil design.
This is contact 9 underneath the body, not an additional side lead.
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