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PC817Phototransistor optocoupler

Pass the signal with light. Keep the two circuits electrically separate.

Manufacturer-referenced

Sharp · PC817X1NSZ1B

DIP-4OP18002EN · January 2018 · selected rank A

PC817 is a four-pin optocoupler with an infrared LED and an NPN phototransistor inside one package. Light carries the signal across the insulating barrier; there is no internal conductive connection between the two sides. This page follows Sharp’s PC817X1 rank A parts in through-hole and gullwing SMD packages. Their current-transfer ratio is 80–160% at 5 mA LED current, 5 V collector-emitter voltage and 25°C; other PC817 grades have different ranges. A series resistor controls LED current, while a separate supply and pull-up create the output signal. The illustrated common-emitter circuit inverts the input and preserves separate input and output grounds.

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Real View

PC817 rank A Through-hole package with black body, silver leads and pin-one mark.
PC817X1NSZ1B · DIP-4Package illustration

Pinout

PC817DIP-4Top view · pin 1 at the marked corner
Select a pin to see its functionDIP-4 · 4 pins

PCB Footprint

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Finding DIP-4 packageTop view · mm
4Physical pins PC817X1NSZ1BDIP-4 Manufacturer-referencedSharp

Pin diagram

Select a pin to explore its connection

Package map
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PC817DIP-4Top view · pin 1 at the marked corner

Click a lead or use the arrow keys. Top view · pin 1 at the marked corner

1
PIN 1 · Infrared input

A

LED anode

Function

Positive terminal of the internal infrared emitter. Forward current produces the light that controls the output transistor.

How to connect

Drive through a current-limiting resistor from the input circuit.

Electrical note

Select resistance from the input voltage and forward voltage; never connect directly across a voltage source.

Key specifications

The infrared emitter drives a phototransistor through light. Input current, CTR, pull-up resistance and temperature determine the output behavior.

Electrical terminals4 LED + phototransistor
Selected rank A CTR80–160 % · stated test conditions
Operating ambient−30–100 °C · derating applies
Isolation test5 kVrms · 1 minute

Operating profile

Supply, signals and operating conditions

PC817 operating profile
ParameterValueConditions / notes
Selected packageDIP-4PC817X1NSZ1B
Illustrative LED drive≈ 5 mA5 V through 750 Ω
Collector outputInvertingRequires an external pull-up
Use these values with the stated grade and test conditions.

Package details

PC817X1NSZ1B · DIP-4

Selected package
Selected PC817 physical package
PropertyDetails
ManufacturerSharp
Part numberPC817X1NSZ1B
PackageDIP-4
Connections4 pins
MountingThrough-hole
Lead pitch2.54 mm
Package codeDIP
Thermal referenceDerate LED, collector and total dissipation with ambient temperature

Selected devices and pinout

One gain grade · two lead forms

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ParameterValueConditions / notes
Through-hole partPC817X1NSZ1BRank A · four-pin DIP
SMD partPC817X1NIP1BRank A · SMT gullwing DIP, not SOP-4
Pin 1 / pin 2Anode / cathodeInput infrared LED
Pin 4 / pin 3Collector / emitterOutput phototransistor
CTR for selected rank A80–160%Calculated from 4–8 mA collector current at IF = 5 mA, VCE = 5 V, 25°C
Isolation test5 kVrms for 1 minute40–60% RH; not a continuous working-voltage rating

Confirm the complete order code. PC817 variants and manufacturers need not have identical gain or limits.

Electrical characteristics

Sharp test conditions · 25°C

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ParameterValueConditions / notes
LED forward voltage1.2 V typical; 1.4 V maximumIF = 20 mA
LED reverse current10 µA maximumVR = 4 V
Collector dark current100 nA maximumVCE = 50 V; IF = 0
Collector saturation voltage0.1 V typical; 0.2 V maximumIF = 20 mA; IC = 1 mA
Input capacitance30 pF typical; 250 pF maximumV = 0; f = 1 kHz
Input-output capacitance0.6 pF typical; 1.0 pF maximumV = 0; f = 1 MHz

Forward voltage varies with current and temperature. CTR measured at VCE = 5 V does not guarantee the same transfer in saturation.

Response and loading

Load-dependent phototransistor response

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ParameterValueConditions / notes
Rise time4 µs typical; 18 µs maximumVCE = 2 V; IC = 2 mA; RL = 100 Ω
Fall time3 µs typical; 18 µs maximumSame response-time test
Cut-off frequency80 kHz typicalVCE = 5 V; IC = 2 mA; RL = 100 Ω; −3 dB
Output pull-upLower resistance demands more collector currentHigher resistance increases sensitivity to leakage and capacitance
Deep saturationCan slow turn-offAccount for stored charge in switching designs
High-speed protocolsUse a suitable logic-output isolator when neededThe 80 kHz test is not a guaranteed digital data rate

The example uses a 10 kΩ pull-up and therefore does not inherit the 100 Ω switching-time test results.

Isolated logic input

5 V input side · separate 3.3 V output side

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ParameterValueConditions / notes
Input resistance750 ΩExample assumes an approximately 1.2 V LED drop
Estimated LED current5.07 mA(5 − 1.2) / 750
Input resistor dissipationApproximately 19.3 mWIF² × R; 0.125 W or greater nominal rating provides margin
Output pull-up10 kΩ to +3.3 V_BCollector pin 4 is the output node
Low-state pull-up currentUp to approximately 0.33 mA3.3 V / 10 kΩ, ignoring VCE(sat)
GroundsGND_A and GND_B stay separateNo conductive link across the optocoupler

Illustrative low-voltage circuit: verify CTR across temperature and life, logic thresholds, drive capability and switching speed for the actual design.

Absolute maximum ratings

Stress limits at 25°C unless specified

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ParameterValueConditions / notes
Continuous LED current50 mADerate with ambient temperature
LED reverse voltage6 VAvoid reverse stress in normal operation
Collector-emitter voltage80 VLED off
Emitter-collector voltage6 VReverse output polarity limit
Collector current50 mAAlso limited by power dissipation and temperature
LED / collector / total dissipation70 / 150 / 200 mWAt 25°C; derating required
Operating / storage temperature−30–100°C / −55–125°CAmbient operation / unpowered storage

These are stress limits, not recommended continuous operating targets. Isolation-system design also depends on spacing, insulation and applicable standards.

Package and PCB geometry

Same electrical numbering in both packages

Scroll sideways to see all columns.

ParameterValueConditions / notes
Moulded body6.5 × 4.6 mm nominal3.5 mm nominal body height
Lead pitch2.54 mmAlong each two-pin row
DIP footprint7.62 mm row spacingTEP pattern: 1.00 mm holes and 1.80 mm pads
SMD footprint8.20 mm pad-row centresSharp reference pads: 2.20 × 1.70 mm
Pin 1 identificationAnode mark on bodySquare through-hole pad / top-left SMD mark
Board routingPreserve separation across the barrierAvoid copper that bypasses the intended isolation

Dimensions follow Sharp’s mechanical drawings; check the ordered lead form and your fabricator’s tolerances.

Connections by function

Select a pin for its function, connection guidance and electrical notes.

Infrared input2 pins

Isolated output2 pins

Read the conditions with every value

Typical values describe stated test conditions. Absolute maximum ratings are stress limits, not operating targets.

Official PDF datasheet

PC817 at a glance

Follow the labeled connections and functional stages

PC817 working principle: illustrated functional stages, basic circuit and connections
Select the diagram to read it at full resolution.

How it works

3 stages · Explore one step at a time

Step 1 / 3

Turn current into light

Input current flows from anode to cathode through the internal infrared LED. The resistor limits that current.

Step 2 / 3

Cross the insulating barrier

Photons reach the output transistor. No wire or shared ground is needed across the barrier.

Step 3 / 3

Turn light into an output level

The transistor sinks current from the output pull-up. With the LED off, the pull-up restores a high level; with sufficient drive, the output goes low.

PC817 in a circuit

Physical package, two supplies and two separate grounds.

5V_A through switch and750ohm resistor to PC817pin1; pin2 toGND_A. Separate3.3V_B through10kohm pull-up to pin4andMCUinput; pin3toGND_B. Grounds not connected.
Low-voltage teaching circuit. LED on pulls the output low when there is enough collector drive; LED off lets the pull-up restore high.

Connect it, step by step

Follow the component values and pin connections

Limit input current

Drive the anode through 750 Ω; return the cathode only to GND_A.

Power the output side

Pull the collector up to the independently powered 3.3 V_B rail through 10 kΩ.

Read the inverted signal

Connect the collector to the receiving logic input and the emitter to GND_B. Check the receiver’s logic thresholds.

Inside PC817

Infrared emitter and phototransistor inside the four-pin body.

PC817 cutaway: anode1 and cathode2 feed infrared LED; light crosses insulating barrier toward NPN transistor with collector4 and emitter3.
Functional cutaway, not the physical die layout. Light arrows illustrate invisible infrared radiation.

Explore the circuit

Select a stage to see its role and connections

Input emitter

Pins 1 and 2 form the infrared LED. A series resistor sets its current.

Insulating barrier

The input and output have no internal electrical connection.

Output detector

Pins 4 and 3 expose the phototransistor collector and emitter. The base is internal.

Selected packageDIP-4PC817X1NSZ1B
Physical connections4 pinsPackage-specific numbering
Reference collection7 tables37 parameters & pin functions

Pin reference

Signal names, electrical functions and connection guidance

DIP-4
Physical pin numbers4 pins

Scroll within the table to see all columns and rows.

PC817 pin functions and connections
PinSignalTypeFunction & connection
ALED anodePositive terminal of the internal infrared emitter. Forward current produces the light that controls the output transistor.
Connection guidance

Drive through a current-limiting resistor from the input circuit.

Select resistance from the input voltage and forward voltage; never connect directly across a voltage source.

KLED cathodeNegative terminal of the infrared emitter.
Connection guidance

Return to the input-side ground or input driver.

This is not internally connected to the output emitter or its ground.

EPhototransistor emitterEmitter of the isolated NPN phototransistor.
Connection guidance

For the common-emitter example, return to the output-side ground.

There is no base pin. Light from the input emitter controls collector current.

CPhototransistor collectorCollector of the isolated NPN phototransistor.
Connection guidance

Connect a pull-up resistor to the output-side supply; take the output signal from this node.

Light increases collector conduction and pulls the common-emitter output low. The output needs its own supply.

DIP-4 · Top view · pin 1 at the marked corner · Select a pin number to open its interactive pinout.

Selected devices and pinout

One gain grade · two lead forms

Manufacturer-referenced values6 parameters

Scroll within the table to see all columns and rows.

ParameterValueConditions / notes
Through-hole partPC817X1NSZ1BRank A · four-pin DIP
SMD partPC817X1NIP1BRank A · SMT gullwing DIP, not SOP-4
Pin 1 / pin 2Anode / cathodeInput infrared LED
Pin 4 / pin 3Collector / emitterOutput phototransistor
CTR for selected rank A80–160%Calculated from 4–8 mA collector current at IF = 5 mA, VCE = 5 V, 25°C
Isolation test5 kVrms for 1 minute40–60% RH; not a continuous working-voltage rating

Confirm the complete order code. PC817 variants and manufacturers need not have identical gain or limits.

Electrical characteristics

Sharp test conditions · 25°C

Manufacturer-referenced values6 parameters

Scroll within the table to see all columns and rows.

ParameterValueConditions / notes
LED forward voltage1.2 V typical; 1.4 V maximumIF = 20 mA
LED reverse current10 µA maximumVR = 4 V
Collector dark current100 nA maximumVCE = 50 V; IF = 0
Collector saturation voltage0.1 V typical; 0.2 V maximumIF = 20 mA; IC = 1 mA
Input capacitance30 pF typical; 250 pF maximumV = 0; f = 1 kHz
Input-output capacitance0.6 pF typical; 1.0 pF maximumV = 0; f = 1 MHz

Forward voltage varies with current and temperature. CTR measured at VCE = 5 V does not guarantee the same transfer in saturation.

Response and loading

Load-dependent phototransistor response

Manufacturer-referenced values6 parameters

Scroll within the table to see all columns and rows.

ParameterValueConditions / notes
Rise time4 µs typical; 18 µs maximumVCE = 2 V; IC = 2 mA; RL = 100 Ω
Fall time3 µs typical; 18 µs maximumSame response-time test
Cut-off frequency80 kHz typicalVCE = 5 V; IC = 2 mA; RL = 100 Ω; −3 dB
Output pull-upLower resistance demands more collector currentHigher resistance increases sensitivity to leakage and capacitance
Deep saturationCan slow turn-offAccount for stored charge in switching designs
High-speed protocolsUse a suitable logic-output isolator when neededThe 80 kHz test is not a guaranteed digital data rate

The example uses a 10 kΩ pull-up and therefore does not inherit the 100 Ω switching-time test results.

Isolated logic input

5 V input side · separate 3.3 V output side

Manufacturer-referenced values6 parameters

Scroll within the table to see all columns and rows.

ParameterValueConditions / notes
Input resistance750 ΩExample assumes an approximately 1.2 V LED drop
Estimated LED current5.07 mA(5 − 1.2) / 750
Input resistor dissipationApproximately 19.3 mWIF² × R; 0.125 W or greater nominal rating provides margin
Output pull-up10 kΩ to +3.3 V_BCollector pin 4 is the output node
Low-state pull-up currentUp to approximately 0.33 mA3.3 V / 10 kΩ, ignoring VCE(sat)
GroundsGND_A and GND_B stay separateNo conductive link across the optocoupler

Illustrative low-voltage circuit: verify CTR across temperature and life, logic thresholds, drive capability and switching speed for the actual design.

Absolute maximum ratings

Stress limits at 25°C unless specified

Manufacturer-referenced values7 parameters

Scroll within the table to see all columns and rows.

ParameterValueConditions / notes
Continuous LED current50 mADerate with ambient temperature
LED reverse voltage6 VAvoid reverse stress in normal operation
Collector-emitter voltage80 VLED off
Emitter-collector voltage6 VReverse output polarity limit
Collector current50 mAAlso limited by power dissipation and temperature
LED / collector / total dissipation70 / 150 / 200 mWAt 25°C; derating required
Operating / storage temperature−30–100°C / −55–125°CAmbient operation / unpowered storage

These are stress limits, not recommended continuous operating targets. Isolation-system design also depends on spacing, insulation and applicable standards.

Package and PCB geometry

Same electrical numbering in both packages

Manufacturer-referenced values6 parameters

Scroll within the table to see all columns and rows.

ParameterValueConditions / notes
Moulded body6.5 × 4.6 mm nominal3.5 mm nominal body height
Lead pitch2.54 mmAlong each two-pin row
DIP footprint7.62 mm row spacingTEP pattern: 1.00 mm holes and 1.80 mm pads
SMD footprint8.20 mm pad-row centresSharp reference pads: 2.20 × 1.70 mm
Pin 1 identificationAnode mark on bodySquare through-hole pad / top-left SMD mark
Board routingPreserve separation across the barrierAvoid copper that bypasses the intended isolation

Dimensions follow Sharp’s mechanical drawings; check the ordered lead form and your fabricator’s tolerances.

Read each value with its conditions

Typical values describe the stated test conditions. Absolute maximum ratings are stress limits, not operating targets.

Sharp · OP18002EN · January 2018 · selected rank A
Official PDF datasheet

Power-supply feedback

Transfer an error signal across an isolation barrier with a suitable reference and loop-compensation circuit.

Manufacturer application guide

Take it into ProTech

Find PC817 in the Components Library to place its schematic symbol and connect its pins.

Reference page · circuit simulation model not yet availableOpen ProTech

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