BMP280 Reference Tables, Pins & Specifications

Pin reference

Signal names, electrical functions and connection guidance

LGA-8

Physical pin numbers8 pins

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BMP280 pin functions and connections
Signal	Type	Function & connection
GND	Ground	First ground pad. Connection guidance Join common ground; connect pad 7 too.
CSB	Active-low SPI select	Selects the digital interface. Connection guidance Tie directly to VDDIO for I²C; use controller chip-select for SPI. For I²C it must already be high during power-on reset.
SDI / SDA	Serial data	SPI input, shared three-wire data or I²C bidirectional data. Connection guidance Connect to 3.3 V controller SDA and a 4.7 kΩ pull-up in the example.
SCK / SCL	Serial clock	SPI or I²C clock from the host. Connection guidance Connect to controller SCL with a pull-up to VDDIO for I²C.
SDO / ADDR	SPI output / I²C address	SPI serial output; the I²C address bit is sampled from its level. Connection guidance Tie to GND for 0x76 or VDDIO for 0x77 in I²C. Do not leave floating in I²C; unconnected in three-wire SPI.
VDDIO	Interface supply	Supplies the digital input/output domain. Connection guidance Use 3.3 V and 100 nF to GND in this example. Operating range 1.2–3.6 V; no 5 V bus pull-ups.
GND	Ground	Second ground pad. Connection guidance Join pad 1 and controller ground.
VDD	Sensor supply	Powers the analog sensing and conversion circuitry. Connection guidance Use 3.3 V and a separate 100 nF to GND. Operating range 1.71–3.6 V.

Recommended operating conditions

Manufacturer-referenced values7 parameters

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Parameter	Value	Conditions / notes
VDD main supply	1.71–3.6 V	3.3 V in the example
VDDIO supply	1.2–3.6 V	Sets the digital logic domain
Operating temperature	−40 to +85°C	Accuracy conditions are narrower
Pressure range	300–1100 hPa	Absolute pressure
Humidity channel	Not present	Use BME280 if humidity is required
Startup before communication	2 ms	Also wait until status.im_update clears
Sleep current	0.1 µA typical	Sensor sleep; excludes external pull-ups and controller

Do not connect 5 V logic or pull-ups to the bare sensor.

Typical or stated accuracy conditions

Manufacturer-referenced values7 parameters

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Parameter	Value	Conditions / notes
Pressure absolute accuracy	±1 hPa typical	950–1050 hPa, 0–40°C
Relative pressure accuracy	±0.12 hPa	700–900 hPa; 25°C
Temperature accuracy	±0.5°C at 25°C	Internal die temperature; board heating affects ambient estimates
Pressure resolution	0.16 Pa	Output resolution is not accuracy
Typical pressure noise	1.3 Pa RMS	Highest resolution, full bandwidth
Filtered pressure noise	0.2 Pa RMS typical	Highest oversampling and lowest bandwidth
Typical current at 1 Hz	2.7 µA	Pressure and temperature

Resolution, noise, accuracy and conversion speed describe different limitations.

I²C and SPI configuration

Manufacturer-referenced values7 parameters

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Parameter	Value	Conditions / notes
I²C chip selection	CSB2 tied to VDDIO	Required from power-on reset
I²C data / clock	SDI3 = SDA; SCK4 = SCL	Pull both bus lines to VDDIO
SDO5 low / high	0x76 / 0x77	Seven-bit addresses; do not float
I²C maximum clock	3.4 MHz	Use the required high-speed protocol; example is 100 kHz
SPI maximum clock	10 MHz	Observe setup, hold and output delay conditions
4-wire SPI	CSB, SCK, SDI, SDO	Separate input and output data
3-wire SPI	CSB, SCK and shared SDI	Set spi3w_en; SDO is unused

A module may contain its own pull-ups or regulator. Inspect its schematic separately.

Read whole measurement groups coherently

Manufacturer-referenced values7 parameters

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Parameter	Value	Conditions / notes
0xD0 chip ID	0x58	Distinguishes the selected part
0xE0 reset	Write 0xB6	Wait for startup / coefficient copy
0xF3 status	Bit 3 measuring; bit 0 im_update	Do not read an old result as a just-triggered conversion
0xF4 ctrl_meas	Temperature / pressure oversampling and mode	Example 0x25 = ×1 / ×1 / forced
0xF5 config	Standby time, IIR and 3-wire selection	Configure in sleep; example filter off
0xF7–0xFC	20-bit pressure + 20-bit temperature	MSB, LSB and upper nibble of XLSB
Calibration	Temperature / pressure from 0x88 onward	Use each chip’s stored coefficients

Preserve signed coefficient types and packed fields; raw ADC data is not already °C, Pa or % RH.

Noise, response and current trade-offs

Manufacturer-referenced values7 parameters

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Parameter	Value	Conditions / notes
Sleep	No measurements	Registers remain accessible
Forced	One measurement, then sleep	Host triggers the next result
Normal	Repeated measurement and standby	Choose standby for the required update rate
Oversampling	Skipped or ×1 / ×2 / ×4 / ×8 / ×16	Each enabled channel configured separately
IIR	Off / 2 / 4 / 8 / 16	Pressure and temperature; not humidity
Example conversion maximum	6.425 ms	×1 temperature and pressure; manufacturer timing formula
Fresh result check	Wait for the conversion to finish	Allow the full bounded duration or observe the busy-to-idle transition

Firmware must allow startup and bus time as well as the acquisition itself.

A bare-sensor connection

Manufacturer-referenced values7 parameters

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Parameter	Value	Conditions / notes
VDD8 and VDDIO6	3.3 V	Separate 100 nF capacitors to common ground
GND1 and GND7	Common ground	Connect both pads
CSB2	3.3 V	Select I²C from startup
SDO5	GND	Address 0x76
SDA3 and SCL4	3.3 V controller	4.7 kΩ example pull-ups; verify bus rise time
Firmware order	Reset / wait / coefficients / configuration / convert / read	Temperature compensation before dependent channels
Display examples	25.0°C · 1000.0 hPa	Illustrative engineering-unit values, not live readings

The display belongs to the host system, not the sensor package.

Clockwise top-view numbering

Manufacturer-referenced values7 parameters

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Parameter	Value	Conditions / notes
Package body	2 × 2.5 × 0.95 mm	Eight-contact metal-lid LGA
Pad pitch	0.65 mm	Four contacts on each of two opposite sides
Top-view order	Right: 1,2,3,4 · left: 8,7,6,5	Top to bottom; bottom view is mirrored
Vent opening	Keep clear	Avoid coating, adhesive or contamination in the port
Thermal placement	Away from hot ICs and airflow artifacts	Temperature senses package conditions
PCB lands	Authored 0.50 × 0.35 mm; 1.50 mm row centers	Starting pattern checked against the package outline
Humidity handling	No humidity sensing element	Review the complete manufacturer assembly instructions

The bare IC and a breakout module have different size, pinout and supporting circuitry.