BETAPressure range300–1100 hPa
Digital barometric pressure sensor
BMP280 Specifications
Review BMP280 electrical specifications, operating conditions and package details.
Key specifications
Factory calibration belongs to each individual sensor. Read its coefficients, acquire a complete result and apply the manufacturer compensation in the correct order.
Main supply1.71–3.6 V
Interface choicesI²C / SPI 3- or 4-wire SPI
Operating temperature−40–85 °C
Package details
BMP280 · LGA-8
| Property | Details |
|---|---|
| Manufacturer | Bosch Sensortec |
| Part number | BMP280 |
| Package | LGA-8 |
| Connections | 8 pins |
| Mounting | SMD |
| Lead pitch | 0.65 mm |
| Package code | Metal-lid LGA |
| Thermal reference | Keep the vent open and isolate from board heat |
Supply and environment
Recommended operating conditions
Manufacturer specifications 7 parameters
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| Parameter | Value | Conditions / notes |
|---|---|---|
| VDD main supply | 1.71–3.6 V | 3.3 V in the example |
| VDDIO supply | 1.2–3.6 V | Sets the digital logic domain |
| Operating temperature | −40 to +85°C | Accuracy conditions are narrower |
| Pressure range | 300–1100 hPa | Absolute pressure |
| Humidity channel | Not present | Use BME280 if humidity is required |
| Startup before communication | 2 ms | Also wait until status.im_update clears |
| Sleep current | 0.1 µA typical | Sensor sleep; excludes external pull-ups and controller |
No specifications match. Try a parameter name or a unit.
Do not connect 5 V logic or pull-ups to the bare sensor.
Measurement performance
Typical or stated accuracy conditions
Manufacturer specifications 7 parameters
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| Parameter | Value | Conditions / notes |
|---|---|---|
| Pressure absolute accuracy | ±1 hPa typical | 950–1050 hPa, 0–40°C |
| Relative pressure accuracy | ±0.12 hPa | 700–900 hPa; 25°C |
| Temperature accuracy | ±0.5°C at 25°C | Internal die temperature; board heating affects ambient estimates |
| Pressure resolution | 0.16 Pa | Output resolution is not accuracy |
| Typical pressure noise | 1.3 Pa RMS | Highest resolution, full bandwidth |
| Filtered pressure noise | 0.2 Pa RMS typical | Highest oversampling and lowest bandwidth |
| Typical current at 1 Hz | 2.7 µA | Pressure and temperature |
No specifications match. Try a parameter name or a unit.
Resolution, noise, accuracy and conversion speed describe different limitations.
Digital interfaces
I²C and SPI configuration
Manufacturer specifications 7 parameters
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| Parameter | Value | Conditions / notes |
|---|---|---|
| I²C chip selection | CSB2 tied to VDDIO | Required from power-on reset |
| I²C data / clock | SDI3 = SDA; SCK4 = SCL | Pull both bus lines to VDDIO |
| SDO5 low / high | 0x76 / 0x77 | Seven-bit addresses; do not float |
| I²C maximum clock | 3.4 MHz | Use the required high-speed protocol; example is 100 kHz |
| SPI maximum clock | 10 MHz | Observe setup, hold and output delay conditions |
| 4-wire SPI | CSB, SCK, SDI, SDO | Separate input and output data |
| 3-wire SPI | CSB, SCK and shared SDI | Set spi3w_en; SDO is unused |
No specifications match. Try a parameter name or a unit.
A module may contain its own pull-ups or regulator. Inspect its schematic separately.
Registers and calibration
Read whole measurement groups coherently
Manufacturer specifications 7 parameters
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| Parameter | Value | Conditions / notes |
|---|---|---|
| 0xD0 chip ID | 0x58 | Distinguishes the selected part |
| 0xE0 reset | Write 0xB6 | Wait for startup / coefficient copy |
| 0xF3 status | Bit 3 measuring; bit 0 im_update | Do not read an old result as a just-triggered conversion |
| 0xF4 ctrl_meas | Temperature / pressure oversampling and mode | Example 0x25 = ×1 / ×1 / forced |
| 0xF5 config | Standby time, IIR and 3-wire selection | Configure in sleep; example filter off |
| 0xF7–0xFC | 20-bit pressure + 20-bit temperature | MSB, LSB and upper nibble of XLSB |
| Calibration | Temperature / pressure from 0x88 onward | Use each chip’s stored coefficients |
No specifications match. Try a parameter name or a unit.
Preserve signed coefficient types and packed fields; raw ADC data is not already °C, Pa or % RH.
Acquisition modes and timing
Noise, response and current trade-offs
Manufacturer specifications 7 parameters
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| Parameter | Value | Conditions / notes |
|---|---|---|
| Sleep | No measurements | Registers remain accessible |
| Forced | One measurement, then sleep | Host triggers the next result |
| Normal | Repeated measurement and standby | Choose standby for the required update rate |
| Oversampling | Skipped or ×1 / ×2 / ×4 / ×8 / ×16 | Each enabled channel configured separately |
| IIR | Off / 2 / 4 / 8 / 16 | Pressure and temperature; not humidity |
| Example conversion maximum | 6.425 ms | ×1 temperature and pressure; manufacturer timing formula |
| Fresh result check | Wait for the conversion to finish | Allow the full bounded duration or observe the busy-to-idle transition |
No specifications match. Try a parameter name or a unit.
Firmware must allow startup and bus time as well as the acquisition itself.
3.3 V I²C measurement
A bare-sensor connection
Manufacturer specifications 7 parameters
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| Parameter | Value | Conditions / notes |
|---|---|---|
| VDD8 and VDDIO6 | 3.3 V | Separate 100 nF capacitors to common ground |
| GND1 and GND7 | Common ground | Connect both pads |
| CSB2 | 3.3 V | Select I²C from startup |
| SDO5 | GND | Address 0x76 |
| SDA3 and SCL4 | 3.3 V controller | 4.7 kΩ example pull-ups; verify bus rise time |
| Firmware order | Reset / wait / coefficients / configuration / convert / read | Temperature compensation before dependent channels |
| Display examples | 25.0°C · 1000.0 hPa | Illustrative engineering-unit values, not live readings |
No specifications match. Try a parameter name or a unit.
The display belongs to the host system, not the sensor package.
Package and assembly
Clockwise top-view numbering
Manufacturer specifications 7 parameters
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| Parameter | Value | Conditions / notes |
|---|---|---|
| Package body | 2 × 2.5 × 0.95 mm | Eight-contact metal-lid LGA |
| Pad pitch | 0.65 mm | Four contacts on each of two opposite sides |
| Top-view order | Right: 1,2,3,4 · left: 8,7,6,5 | Top to bottom; bottom view is mirrored |
| Vent opening | Keep clear | Avoid coating, adhesive or contamination in the port |
| Thermal placement | Away from hot ICs and airflow artifacts | Temperature senses package conditions |
| PCB lands | Authored 0.50 × 0.35 mm; 1.50 mm row centers | Starting pattern checked against the package outline |
| Humidity handling | No humidity sensing element | Review the complete manufacturer assembly instructions |
No specifications match. Try a parameter name or a unit.
The bare IC and a breakout module have different size, pinout and supporting circuitry.
Connections by function
Select a pin for its function, connection guidance and electrical notes.