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Chiplet-Based Design: How Advanced Packaging Is Changing PCB Architecture
Chiplet-Based Design: How Advanced Packaging Is Changing PCB Architecture
For decades, electronic systems have been built around a relatively clear hierarchy. Transistors form an integrated circuit, the integrated circuit is enclosed in a package, and the package is mounted on a printed circuit board. The PCB then connects processors, memory, communication devices, power converters, sensors, and external interfaces into a complete product.Chiplet-based design is making that hierarchy less distinct. Instead of placing every major function inside one large monolithic system-on-chip, engineers can divide the system into smaller semiconductor dies called chiplets. These dies may be manufactured with different process technologies and then connected inside an advanced package. The result behaves like a highly integrated device, even though it contains several separat ...