Enclosures in modern high-performance embedded systems, industrial IoT devices, and RF hardware are not mere decorative dust covers. The components are becoming increasingly dense with a lot of high-power processing, GaN/SiC power stages, and high-frequency transceivers in a very small area. This type of physical compactness gives rise to severe thermal issues and risk of electromagnetic interference (EMI) that may lower the quality of signals or make the device perform in a throttled way. A bespoke enclosure made out of aluminum can be a multi-functional part of the system providing protection for electronics while allowing dissipation of heat by convection and also acting as an EMI-enclosing Faraday cage in a typical electronics packaging environment.
Metal stamped sheet and die casting ...
